ASMPT presence at FIEE features suite of solutions
Summary
The new DEK TQ L print platform, market-leading SIPLACE SX placement equipment, along with workforce optimisation software like WORKS Command Center and the newly-launched Virtual Assist, will be demonstrated at the event. “At this year’s FIEE, we look forward to illustrating our proven technologies for smart factory open automation and digitalisation.” Following its highly-successful North American debut at the start of 2023, the DEK TQ L will be a highlight of ASMPT booth G10. The feature-rich DEK TQ L combines a small footprint, fast cycle time, pinpoint accuracy, and rugged structure to enable continuous production. Unique features like dual-cover access for solder paste replenishment without an equipment stop, automatic Smart Pin support, and maximum consumables capacity enable zero-assist-required full-shift processing. Also on show is ASMPT’s SIPLACE SX placement platform, revered for its flexibility and scalability, allowing the addition and interchangeability of gantries to scale up, down, or transfer capacity as needed.