Global semiconductor packaging materials market to near $30bn by 2027
Summary
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach $29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the $26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, AI and the adoption of heterogeneous integration and system-in-package technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth. "The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials," said Jan Vardaman, President and Founder of TechSearch International. "Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging, flip chip, and 2.5D/3D packaging.