Syntegon launches cloud-based software and filling solution
Summary
Provider of processing, filling and packaging technology Syntegon is set to exhibit its new cloud-based data collection and visualisation software Synexio at Interpack 2023. Syntegon product manager expert services Elisa Hein said: “Now that our customers are successfully implementing the basic package, we are ready to upgrade to the next level.” The second Synexio upgraded package is “Uptime.” Hein explained: “Besides machine availability, we can now also identify specific potential for improvement, for example by visualising the most frequent reasons for stops.” Cloud-based technology is becoming more prevalent in the packaging industry, with materials science and manufacturing company Avery Dennison announcing that it is adding ChatGPT and artificial intelligence (AI) functionality to its atma.io-connected product cloud. The carrier plates can be detached from the transport chain and replaced with the desired format to adjust the diameter, shape or filling volume of the cups. The LFS is a joint development of two Syntegon companies: the Königsbrunn-based Ampack GmbH designed the solution with the US manufacturer of filling and sealing technology Osgood Industries. Thanks to its modular design, the LFS can be adapted to the respective market and production conditions with little effort – ensuring future-proof processes.” Syntegon was founded in 1969 and is headquartered in Waiblingen, Germany.