Heraeus Electronics showcases next-generation power electronics and semiconductor packaging at SEMICON Korea 2023
Summary
Heraeus Electronics will display three of its newest products that offer solutions to thermal dissipation, miniaturisation, and defect challenges: mAgic DA320, Welco AP520, and AP500X. mAgic DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. Welco AP520 is a water-soluble type 7 printing paste designed to solve the challenges of miniaturisation, as it can create tiny and reliable joints with close to zero defects. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. With the latest materials portfolio, Heraeus Electronics is prepared to support customers in response to trends and challenges for EVs, 5G communications, IoT, AI, HPC, and environmental sustainability.