SEMICON Japan 2022 showcases new technologies
Summary
Themed Forward as One, SEMICON Japan 2022 highlights cutting-edge technology innovations in areas including artificial intelligence (AI), robotics, autonomous vehicles, green energy, Internet of Things (IoT), medtech, and quantum computing. “In addition, SEMICON Japan 2022 comes as Rapidus plans to reach volume production of state-of-the-art 2nm logic chips within the next five years and Japan intensifies its focus on developing advanced packaging technologies.” Underscoring its renewed commitment to becoming a leading manufacturer of advanced chips, Japan last month announced an initial investment of 70 billion yen (US$500 million) in Rapidus, a new Japanese chip production company created by Denso, Kioxia, MUFG Bank, NEC, NTT, Softbank, Sony Group and Toyota Motor. The new Advanced Packaging and Chiplets Summit (APCS), hosted by SEMI in conjunction with SEMICON Japan 2022, will highlight the latest packaging technologies and innovations from top players and explore opportunities for driving semiconductor performance increases beyond traditional process scaling. The Summit will feature more than 70 exhibitors and presentations by nearly 20 thought leaders from chip industry powerhouses including ASE, Intel and TSMC. • Power and Compound Semiconductor Pavilion – Atecom Technology, Nippo Precision, and the Welsh Government • Quantum Computing Pavilion – blueqat, FormFactor, JSR, Keysight Technologies Japan, National Institute of Advanced Industrial Science and Technology (AIST), SEMI Quantum Computer Council, Sumitomo Heavy Industries, and Zurich Instruments For a detailed schedule, please see the SEMICON Japan 2022 Agenda-at-a-Glance.