Eliyan - Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies
Summary
As part of the investment from Tracker Capital, made in February 2022, Dr. Shaygan Kheradpir of Cerberus, former Group CIO and a founding member of the Executive Leadership Committee at Verizon, will join the Board of Directors of Eliyan.Funding and support from leading industry players enable fast-track design, testing, and implementation ramp-up, culminating with the demonstration of the commercial readiness of Eliyans best-in-class chiplet interconnect technology in a recent, successful tapeout using TSMCs 5nm process. Our extensive background in developing bleeding-edge technologies in this space led us to focus on a key challenge: interconnect improvements for system-in-package and chip-to-memory architectures as the path to deliver performance scaling, said Eliyan CEO and co-founder, Ramin Farjadrad. Shaygan Kheradpir of Cerberus commented: Traditional methods of integrating multi-chip architectures impose challenges that result in high costs, low yield, manufacturing complexity, and size limitations. This is essential to cost-effectively leveraging the potential of the fast-growing chiplet-based architectures that experts agree are the pathway to extend Moores Law.A track record of interconnect innovation to enable the chiplet ecosystemEliyans BoW approach was specifically developed to address the need for highly efficient die-to-die (D2D) PHYs to connect different functions in one package.Its NuLink technology, which is a superset of BoW and UCIe, is an innovative PHY technology that uses patented implementation techniques to provide major power-performance differentiation for die-to-die (D2D) connectivity over any packaging substrate, reducing complexity and lowering overall development time and costs. Farjadrads work not only led to the adoption of BoW at OCP, but also helped influence UCIe, which is based on the same signaling/clocking schemes and architecture basics and is widely supported in the industry.An earlier incarnation of the NuLink technology has been mass produced on a 14nm process, validating its commercial viability and performance advantages.