congatec introduces COM-HPC carrier board
Summary
As it is processor socket and vendor independent, the board can be equipped with any high-end Computer-on-Module available in COM-HPC Client Size A, B or C, making OEM designs even more flexible and sustainable. Impressive scalability across the entire range of 12th Generation Intel Core processor-based COM-HPC modules, which congatec offers in 14 different high-end performance flavors, is just the start of possibilities. The combination of application-ready industrial-grade COMs & carrier boards with tailored cooling solutions and comprehensive BSPs for all leading RTOSes and the real-time hypervisor from Real-Time Systems is perfect for fastest time-to-market, produces lowest non-recurring engineering costs, enables customers to react very quickly to changing market requirements and reduces the effort to scale the performance of Micro-ATX based systems to a minimum. Being able to switch the processor performance to any future option without the need to re-build the entire system is thus a huge advantage for many industries,” explains Martin Danzer, Director Product Management at congatec. The conga-HPC/uATX carrier board for COM-HPC Computer-on-Modules in Micro-ATX form factor enables engineers to instantly prototype the next generation of their high-performance embedded and edge computing systems for fastest time to market.