Picosun strengthens its position in semiconductor market
Summary
Picosun Sprinter was first launched in December 2020 as a stand-alone module. Now customer deliveries and installations of Picosun Sprinter clusters have also begun. “A Sprinter cluster consist of two Sprinter modules and a central vacuum wafer-handling robot utilising five wafers handling. The set-up enables a throughput of more than 100 wafers an hour with 10nm aluminium oxide target film thickness”, explained Juhana Kostamo, VP, Industrial Business Area of Picosun Group. “The throughput capability combined with the unique design of the tool’s reaction chamber, the record-breaking batch film quality and the fact that the tool can be fully integrated with the customers’ production line, makes PICOSUN Sprinter the tool of choice for semiconductor, display and IoT component industries who need a future-proof tool with single wafer film quality and uniformity in fast batch processing”, Kostamo concluded.
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