Palomar Technologies offers free webinar

▤ Summary

Of those, ball bonding is substantially more frequently used than any other package interconnect method. This has been the question of most process engineers because, generally speaking, the electrical characteristics of the semiconductor package are affected by the method of wire bonding. However, there are cases where certain packages have physical constraints such as temperature limitation (low heat or no heat applications), such as the use of aluminium wire instead of gold, use of ribbon instead of wire and fine pitch application. Knowing which bonding method to choose is important to a successful package. The webinar takes place on February 23 at 8 am PST.

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