Kulicke & Soffa to Participate at IPC APEX EXPO 2019
Summary
The ergonomically designed feeders deliver improved system-level throughput, higher accuracy and reduced switching costs. K&S invests continually in feature and product development, delivering leading innovation and solutions directly addressing the critical challenges faced by our customers,” said Chan Pin Chong, Kulicke & Soffa’s Senior Vice President for EA/APMR & Wedge Bonder Business Units. Customers can view these technical solutions at IPC APEX EXPO 2019 trade show in California, San Diego Convention Center, Booth Number 2949. Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.