202013 Aug
Samsung Announces Availability of its Silicon-Proven 3D IC Technology
Type
General News
Companies
Source
Guru3d
Summary

Leveraging Samsungs through-silicon via (TSV) technology, X-Cube enables significant leaps in speed and power efficiency to help next-generation applications including 5G, artificial intelligence, high-performance computing, as well as mobile and wearable. " With Samsungs X-Cube, chip designers can enjoy greater flexibility to build custom solutions that best suit their unique requirements. The X-Cube test chip built on 7 nm uses TSV technology to stack SRAM on top of a logic die, freeing up space to pack more memory into a smaller footprint. Enabled by 3D integration, the ultra-thin package design features significantly shorter signal paths between the dies for maximized data transfer speed and energy efficiency. Building on the initial design, Samsung plans to continue collaborating with global fabless customers to facilitate the deployment of 3D IC solutions in next-generation high-performance applications.

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